| 摘要 |
PROBLEM TO BE SOLVED: To achieve stable and highly reliable bonding by increasing the margin, while properly setting bonding conditions for facedown bonding a chip element to a resin board. SOLUTION: When connecting electrodes of a chip element CP are subjected to ultrasonic bonding to wiring electrodes provided on a resin board 10 to thereby mount the element CP on the board 10, a heater 5 is provided which heats the board 10 to a temperature at which the ratio of modulus of elasticity εh of the board 10 at a heated temperature to modulus of elasticity εr thereof at room temperature becomes such that 1>εh/εr>=0.5. The heater 5 can be located on the side of a board mounting table 4. |
