Thermoformable Honeycomb and Method for its Manufacture

摘要

Resins which are a combination of phenolic and polyamide polymers are used as dipping resins to coat composite honeycomb structures. The phenolic/polyamide dipping resins increase the heat formability of composite honeycomb structures. The dip resin forms a coating on the honeycomb which can include from 30 to 95 weight percent phenolic resin and 5 to 30 weight percent polyamide resin. The dip resin is especially useful for coating composite honeycomb cores made from graphite or glass fibers impregnated with flexible phenolic resins. <IMAGE>