发明名称 Low cost mixed memory integration with substantially coplanar gate surfaces
摘要 A semiconductor memory device including at least three of the following cell structures: an NVRAM cell structure, an FERAM cell structure, a DRAM cell structure, and an SRAM cell structure. The cell structures are disposed on the same substrate and preferably have gate surfaces which are substantially coplanar. An NVRAM cell structure. Processes for forming a memory structure that includes NVRAM, FERAM, DRAM, and/or SRAM memory structures on one substrate and processes for forming a new NVRAM cell structure.
申请公布号 US6141242(A) 申请公布日期 2000.10.31
申请号 US19990447629 申请日期 1999.11.23
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HSU, LOUIS LU-CHEN;MANDELMAN, JACK A.;ASSADERAGHI, FARIBORZ
分类号 G11C11/00;H01L21/8242;H01L21/8244;H01L21/8247;H01L27/10;H01L27/105;H01L27/108;H01L27/11;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):G11C13/00 主分类号 G11C11/00
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