发明名称 METHOD AND DEVICE FOR ARRAYING MINUTE BODIES
摘要 PROBLEM TO BE SOLVED: To provide the method and device for arraying minute bodies by which a lot of minute bodies can closely be arrayed uniformly in the height direction with high efficiency to an object on which adhesive materials are arranged. SOLUTION: This device for arraying minute bodies B on an object 71, on which adhesive materials 72 are arranged, is provided with a minute body feeding means 23 for feeding the minute bodies B onto the adhesive materials 72 of the object 71, an aligning means 30 acting as aligning the fed minute bodies B at almost prescribed height and integrally provided with the feeding means 23, and an arranging means 4 for pressing the minute bodies B aligned at the almost prescribed height W to arrange them at prescribed height W1 with respect to the object 71.
申请公布号 JP2000301048(A) 申请公布日期 2000.10.31
申请号 JP19990116020 申请日期 1999.04.23
申请人 SONY CORP 发明人 WATANABE HIDETOSHI;SUZUKI KOJI;ITO HIROTAKA
分类号 B05C19/04;B05C19/06;(IPC1-7):B05C19/04 主分类号 B05C19/04
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