| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multi-layer printed interconnection board including a formation method of a protective film for a roughened surface or roughened layer for simplified manufacturing process, wherein the roughened surface or roughened layer formed on a conductor circuit is sufficiently protected from acid, etc., while the connection reliability with a via hole formed over it is sufficiently assured. SOLUTION: A conductor circuit comprising a plurality of layers with an inter-layer resin insulating layer sandwiched on an insulating substrate is formed by repeating a process where a conductor circuit is formed before roughening to form a roughened surface on the conductor circuit, and the conductor circuit comprising the roughened surface is coated with the inter-layer resin insulating layer before a via hole opening is formed. Here, after a roughened surface 11 is formed on a conductor circuit 5, oxidizing process is performed to form an oxide film 18 over the entire surface of the roughened surface 11, and then an inter-layer resin insulating layer 2 is formed. |
