| 摘要 |
PROBLEM TO BE SOLVED: To provide a metalized substrate wherein corrosion of a conductor layer is effectively prevented while wettability of it is improved. SOLUTION: Related to a metalized substrate 1 where a conductor layer 3 which is to be a circuit is formed on the surface of a ceramics substrate 2, a plating layer 5a which continues from the conductor layer 3 to the surface of ceramics substrate 2 is so formed as to cover the surface part and side part of the conductor layer 3 as well as the joint end part between the conductor layer 3 and ceramics substrate 2. The width of the plating layer 5a projecting over the surface of ceramics substrate 2 from the side surface of the conductor layer 3 is 3μm or wider.
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