METHOD AND DEVICE FOR WASHING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To eliminate the inclusion of impurities such as org. impurities at the time of introducing clean room air into a washing chamber and also to efficiently discharge the air in the washing chamber even at the time when a substrate is rotated at high speed. SOLUTION: The speed control of the clean room air and also the rotary speed control of the substrate 102 by a wafer rotating mechanism 106 are executed at each washing stage (including a rinsing stage) and a substrate drying stage. Concretely, the rotation of the substrate is controlled in the rotary speed in the order in which the retention of stream staying in the washing chamber is not caused.