| 摘要 |
PROBLEM TO BE SOLVED: To speed up polishing by setting a high temperature of polishing fluid. SOLUTION: A plurality of typically granulated or pelletized polishing tools 3 of abrasive grains softer than a workpiece 6 are stuck to a surface plate 2, and the workpiece 6, such as a silicon wafer, is stuck to a sticking plate 5 on a pressure plate 4. Polishing fluid 7 of an alkaline solution heated in the range of 30 to 100 deg.C is supplied between the polishing tools 3 and the workpiece 6, in which condition, rotating both of them in relatively different directions generates frictional force between them to provide chemical/mechanical polishing of the polishing surface of the workpiece 6. |
