发明名称 |
High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding |
摘要 |
A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes. |
申请公布号 |
US6137693(A) |
申请公布日期 |
2000.10.24 |
申请号 |
US19980127531 |
申请日期 |
1998.07.31 |
申请人 |
AGILENT TECHNOLOGIES INC. |
发明人 |
SCHWIEBERT, MATTHEW K.;HUTCHISON, BRIAN R.;CHEW, GEARY L.;BARNETT, RON |
分类号 |
H05K9/00;H01L23/057;H01L23/10;H01L23/552;H01L23/66;H01L25/065;H05K1/02;H05K1/14;H05K3/34;H05K3/36;(IPC1-7):H05K9/00;H05K1/18 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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