| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent generation of warpages or deformations of a circuit board or of air bubbles in a sealing resin, in the manufacturing technology for resin- sealed electronic device such as semiconductor packages. SOLUTION: This method for manufacturing a resin-sealed electronic device is used to cover an electronic component 20 mounted to a circuit board 10 with a sealing resin 30 and to harden the sealing resin 30, so as to seal the electronic part 20. In this case, the method includes a step (a) for supplying the sealing resin 30 to cover the electronic component 20 mounted to the circuit board 10, a first heating step (b) to heat the sealing resin 30 supplied to the circuit board 10 in the step (a) at a lower temperature than the complete hardening temperature, and a second heating step (c) for heating the sealing resin 30 at a higher temperature than that of the step (b), where the sealing resin is hardened completely.</p> |
