SOLDER BALL MOUNTING METHOD AND DEVICE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a solder ball mounting method and a device thereof by which tens of thousands of solder balls can be mounted on a work at a time. SOLUTION: A device for mounting solder balls is provided with a tilt table 4 which can swing, a table fixed on the tilt table 4, a mask jig 15 in which several rectangular though holes corresponding to the solder ball mounting area of a work 14 are formed and which is slidably supported by the tilt table 4, a mask 20 in which several through holes of diameter slightly larger than that of solder balls 19 and which is fixed to the mask jig 15, and a squeegee 34 which is slidably mounded on the mask jig 15.