| 摘要 |
PROBLEM TO BE SOLVED: To adequately realize avoidance of the poor discharge, increase in discharge rate, avoidance of the discharge quantity variation, and stabilization of the discharge. SOLUTION: A bump forming apparatus comprises a first tank 3 for storing a molten solder 1, a cavity 6 having an inlet 5 for the solder 1, a nozzle 8 disposed at the bottom of the cavity 6, a pressuring element composed of a diaphragm 9 and a piezoelectric element 10, a first heater 11 for heating the first tank 3, a piping 4 and the cavity 6. The apparatus has a static pressure controller comprising a second tank 14 for storing solid solder 12, a second heater 15 disposed around a second opening 13, a liq. level detector 16 for detecting the liquid of the molten solder 1 in the first tank 3, and a liquid controller 17 for controlling the drive of the second heater 15, based on a detection signal from the detector 16. |
