| 摘要 |
PROBLEM TO BE SOLVED: To make an apparatus highly efficient by making a handling mechanism grab a semiconductor smoothly. SOLUTION: The apparatus includes a pressing part 21 for pressing down an upper lid part 12B of an IC socket 12 to release engagement of a semiconductor device S, a driving motor 22 for lowering the pressing part 21 and a suction pad 24 for sucking and pulling up the semiconductor device S. A CPU 32 for controlling a driver 31 driving the driving motor 22 is set to a handling mechanism 5, An amount of the driving of the driving motor 22 is controlled by the driver 31 on the basis of air pressure data from an air pressure device 34 which makes the suction pad 24 suck and pull up the semiconductor device S, and an amount of lowering the pressing part 21 is increased by every predetermined amount. The engagement state of the semiconductor device S by the upper lid part 12B is surely released, and the suction pad 24 is let to suck and pull up the semiconductor device S.
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