| 摘要 |
PROBLEM TO BE SOLVED: To obtain film-forming compositions excellent in dielectric properties, mechanical strength and the like, and films obtainable by curing these compositions. SOLUTION: Film-forming compositions contain (A) a hydrolyzate of a compound represented by the formula: R1nSi(OR2)4-n (wherein R1 and R2 may be the same or different and each is a monovalent organic group; and n is an integer of 0-2) and its partial condensation product or either of the two, (B) an acid catalyst, and (C) a compound having a boiling point or a decomposition temperature of 250-450 deg.C which is miscible with or dispersible in component (A). Two or more compounds represented by the above described formula are preferably used.
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