| 发明名称 |
COMPONENT CARRIER AND METHOD FOR THE MANUFACTURE, INTEGRATED CIRCUIT |
| 摘要 |
Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine. |
| 申请公布号 |
KR100268212(B1) |
申请公布日期 |
2000.10.16 |
| 申请号 |
KR19970045107 |
申请日期 |
1997.08.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION. |
发明人 |
NATALIE BARBARA FEILCHENFELD;STEPHEN, JOSEPH FUERNISS;MICHAEL, ANTHONY GAYNES;MARK, VINCENT PIERSON;PAT, HOONTRAKUL |
| 分类号 |
G03F7/00;H01L21/48;H01L21/56;H01L21/60;H01L23/498;H05K3/12;H05K3/28;H05K3/32;H05K3/34 |
主分类号 |
G03F7/00 |
| 代理机构 |
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