RUTHENIUM PLATED LEAD FRAME

摘要

PURPOSE: A ruthenium plated lead frame is provided to prevent decay of nickel by forming a protection layer composed of ruthenium and ruthenium alloy on the surface of the nickel foil and to improve the strength of solder attachment. CONSTITUTION: The frame includes a metal substrate(21), and a nickel alloy foil(22). The metal substrate includes the inner lead and an outer lead. The nickel foil or the nickel alloy foil is formed on the metal substrate. The ruthenium foil or the ruthenium alloy foil is accumulated on the surface of the nickel foil or the nickel alloy foil. The metal substrate is made of copper, copper alloy, iron, iron alloy, nickel, and nickel alloy.