| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for transfer molding excellent in filling properties in gaps between a semiconductor element and a substrate, moisture resistance reliability and solder reflow crack resistance in a semiconductor device of a flip chip packaging system. SOLUTION: The characteristic of this composition is an epoxy resin composition consisting essentially of solid epoxy resin, a solid phenol resin, a spherical inorganic filler and a curing accelerator having <=24μm maximum grain diameter and 0.1-15μm average grain diameter of the spherical inorganic filler and containing the spherical inorganic filler in an amount of 70-93 wt.% in the whole epoxy resin composition.
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