| 摘要 |
PROBLEM TO BE SOLVED: To reduce influence on the human body and environment, to facilitate treatability and to make better the adhesive performance between an insulating coating film and a metallic plating coating film without depending on Tg in the insulating coating film by allowing this agent to contain hydrophobic alcohols, a hydrophilic solvent or surfactant. SOLUTION: This is a water soluble preetching agent for subjecting the surface of an interlayer insulating film to roughening treatment for applying electroless copper plating in the process of producing a both side printed circuit board, particularly in the process of producing a build-up substrate. The hydrophobic alcohols are the ones in which solubility to water at 25 deg.C is <5 wt.%, prefreably <4 wt.%, and the hydrophilic solvent or surfactant is the one in which solubility to water at 25 deg.C is >=5 wt.%. As the hydrophobic alcohols, cyclohexanol, benzyl alcohol, 1-pentanol, isopentyl alcohol, or the like, can be cited, and particularly, aralkyl alcohol, e.g. benzyl alcohol is preferable.
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