发明名称 METHOD OF BONDING
摘要 PROBLEM TO BE SOLVED: To bond quartz to a metal membrane by closely contacting a first member having the metal membrane formed on a connecting face, with a second member through the metal membrane, imparting a prescribed load thereto, and bonding the second member side to the anode of an electric source to impress a voltage. SOLUTION: The voltage is impressed under a heating condition under which the metal membrane and the second member are not melted to carry out the objective bonding. The material of the metal membrane is preferably selected from a group of aluminum, chromium, silicon and an alloy thereof, and the first and the second members are preferably composed of quartz. The metal membrane 11 is formed on the connecting face of the substrate 10 of a quartz wafer by spattering, and the quartz member 12 is placed thereon. Each member is heated to the temperature lower than the softening point of the glass, or about 350 deg.C, and about 3.5 kV dc voltage is impressed to the substrate 10 and the quartz member 12 through the metal membrane 11 so that the quartz member 12 may be bonded to the cathode. The voltage is preferably impressed in a state in which both thereof are stuck by applying a load. The substrate 10 can be goodly bonded to the quartz member 12 through the metal membrane 11.
申请公布号 JP2000281459(A) 申请公布日期 2000.10.10
申请号 JP19990082107 申请日期 1999.03.25
申请人 SEIKO INSTRUMENTS INC 发明人 SHIRAISHI MASAYOSHI;ARATAKE KIYOSHI
分类号 B23K20/16;C04B37/00;C30B33/06;(IPC1-7):C04B37/00 主分类号 B23K20/16
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