| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board suitable for an electronic circuit board or a package or the like, on which an electronic component such as a semiconductor element operating at a high speed is loaded for reducing crosstalk noise among wiring in alternately laminated parallel wiring groups, and for facilitating countermeasures to EMI noise without deteriorating electrical characteristics. SOLUTION: This multilayer wiring board is provided with a laminated wiring body, in which a second insulating layer I2 having a second parallel wiring group L2 including signal wiring S2 orthogonally crossing a first parallel wiring group L1, is laminated on a first insulating layer I1 having a first parallel wiring group L1 which includes signal wiring S1, and the first and second parallel wiring groups L1 and L2 are electrically connected through a through- conductor group, and a ground conductor layer GL having openings A with width which is 500μm or less facing the signal wiring S2 is arranged at the upper part and/or lower part of the laminated wiring body. Thus, it is possible to facilitate countermeasures to an EMI noise, without generating mismatching of the impedance of the signal wiring.
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