发明名称 CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a circuit board, wherein the bonding property of an electrode part which is formed on one face of a ceramic board and which comprises a plated layer on the outermost layer to a protective film which covers the electrode part can be enhanced. SOLUTION: Amorphous glass is used as a material for a protective film 16. Since amorphous glass does not have a crystallization temperature, it is set to a state, that it is always in a softened state in a temperature region at a softening temperature or higher, and the wetting time with reference to a plated layer 14 by the material for the protective film can be ensured to be long. Thereby, it is possible to ensure sufficient bonding strength even with respect to the plated layer 14 in which there are small irregularities and oxides.
申请公布号 JP2000277891(A) 申请公布日期 2000.10.06
申请号 JP19990078294 申请日期 1999.03.23
申请人 DENSO CORP 发明人 OKA KENGO;OTA SHINJI;ASAI YASUTOMI;NAGASAKA TAKASHI
分类号 H05K3/28;(IPC1-7):H05K3/28 主分类号 H05K3/28
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