| 摘要 |
<p>A heat conductive molded body effectively radiating heat generated from semiconductor elements, a power supply or light source used for electric apparatuses, and a manufacturing method thereof and a semiconductor device having good heat radiation are disclosed. Specifically, a heat conductive molded body (3), wherein a diamagnetic filler having a thermal conductivity of 20 W/m . K or more is orientated in a fixed direction in a high polymer; a manufacturing method of the heat conductive molded body, wherein a magnetic field is applied to a high polymer composition containing the diamagnetic filler, and the diamagnetic filler contained in the composition is oriented and hardened in a fixed direction; and a semiconductor wherein said heat conductive molded body is interposed between a semi-conductor element (2) and a heat conductive member (4) are disclosed. <IMAGE></p> |
