| 摘要 |
A semiconductor device (1) comprises a semiconductor chip (12) provided with: a plurality of electrode pads (14); an insulating film (16) having an opening (16a) over the respective electrode pads (14) formed on the semiconductor chip (12); a plurality of lower electrodes (19) provided on the insulating film (16) in such a way to be electrically conductive with the respective electrode pads (14) through the respective openings (16a); and a plurality of bumps (22), each provided on the respective lower electrodes (19) so as to overhang from respective sidewall faces (12b, 12c) of the semiconductor chip (12). By mounting the semiconductor device (1) on a circuit board such that one of the sidewall faces of the semiconductor chip (12) is opposite the circuit board, and by connecting the plurality of the bumps (22) with electrodes on the circuit board, respectively, an area of junction therebetween is reduced, thereby enabling an electronic device to be downsized. <IMAGE> |
