发明名称 PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a package scarcely or not at all having warpage in a flange part before and after a hot wall disinfection treatment regarding a package with a content filled in a molded main body to be sealed in use of a lid body. SOLUTION: The package comprises a molded main body and lid body, in which the main body is made up of a surface layer, and intermediate layer, and a seal layer, and the lid body is formed of a surface layer, and intermediate layer, and a seal layer, and further, the surface of the main body contains polycyclohexadimethylene terephthalate(PCT) resin, and the surface layer of the lid body contains PCT resin or biaxially oriented polyester resin, herein, a thickness ratio of each surface layer is 5-50% of the thickness of the main body and the lid body respectively.
申请公布号 JP2000272665(A) 申请公布日期 2000.10.03
申请号 JP19990074965 申请日期 1999.03.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 OCHI SHUNSUKE
分类号 B65D77/20;B32B27/36;(IPC1-7):B65D77/20 主分类号 B65D77/20
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