| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor composition having excellent adhesive strength in a humidified condition without gas emission when heated by blending a thermoplastic silicone modified polyimide resin, an epoxy resin, a specific amount of an aminosilane as its essential components for adhesion between a semiconductor device and a wiring substrate. SOLUTION: The composition to be used contains 100 pts.wt. of a thermoplastic silicone modified polyimide resin having a structure of the formula in its main chain, 1-100 pts.wt. of an epoxy resin having a weight average molecular weight of not less than 2,000 and less than 200,000 which is obtained by reacting an oligoethylene glycol diglycidylether and bisphenol A, and 0.15-5.10 pts.wt. of an aminosilane as its essential components. In the formula, R1 and R2 are each a 1-6 C aliphatic hydrocarbon or an aromatic hydrocarbon; and (n) is not less than 6 and less and 16. The resin of the formula can be prepared by using a silicone diamine such asα,ω-bis(3-amino propyl)polydimethylsiloxane, or the like, while producing a polyimide.
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