发明名称 |
High speed lead inspection system |
摘要 |
An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.
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申请公布号 |
US6128034(A) |
申请公布日期 |
2000.10.03 |
申请号 |
US19940200616 |
申请日期 |
1994.02.18 |
申请人 |
SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS, INC. |
发明人 |
HARRIS, CHARLES K.;ZEMEK, MICHAEL C. |
分类号 |
H04N7/18;H05K13/08;(IPC1-7):H04N7/18 |
主分类号 |
H04N7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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