发明名称 High speed lead inspection system
摘要 An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.
申请公布号 US6128034(A) 申请公布日期 2000.10.03
申请号 US19940200616 申请日期 1994.02.18
申请人 SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS, INC. 发明人 HARRIS, CHARLES K.;ZEMEK, MICHAEL C.
分类号 H04N7/18;H05K13/08;(IPC1-7):H04N7/18 主分类号 H04N7/18
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