| 摘要 |
PROBLEM TO BE SOLVED: To prevent imparting adverse effects on a polisher with a chemical agent of an etchant in the polisher, in which etching mechanism is made in-line. SOLUTION: This etching mechanism annexed polisher for a wafer W comprises (A) a polisher 101, provided with a polishing whetstone enclosed with the entire partition wall, a wafer cleaning mechanism, and a wafer conveying mechanism; and (B) an etching mechanism annexed polisher for the wafer W having an etching mechanism 20 provided with a conveying robot enclosed by the entire partition wall, an etchant supply nozzle, and a spinner. A partition wall between the polisher and etching mechanism has an opening part, in which an attractive pad provided with an arm of a conveying robot of the etching mechanism can be projected and recessed, so that the suction pad can suck the wafer W mounted on a cleaning mechanism 113 of the polisher, and convey it onto a wafer mounted plate of the spinner of the etching mechanism. This opening has a structure which can be opened and closed by a shutter.
|
