| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element in which heat radiation is improved and surface protection agent is applied simply and easily to a semiconductor chip. SOLUTION: This semiconductor element is constituted by fastening fastening parts 25a and 25b of a connector 24, fixed to a lead frame 27a, and a lead frame 27b, to an upper electrode surface 21a and a lower electrode surface 21b of a semiconductor chip 21, respectively, with solder 26a and 26b, and a hollow recess 28 provided with semicircular notches 29a, 29b and 29c, in which solder 30 remaining at fastening gathers is provided on a peripheral part of the fastening part 25a of the connector 24 so as to be placed at peripheral part of the upper electrode surface 21a of the semiconductor chip 21. |
