| 摘要 |
PROBLEM TO BE SOLVED: To prevent a light-shielding film around a small opening from being heated by providing a layer that is made of a material with improved thermal conductivity at a part in close contact with the small opening. SOLUTION: First, a taper part 42 is formed in a silicon substrate 41 by the etching method with the anisotropy of silicon, and then an SiO2 layer is formed on its upper surface by thermal oxidation or the like. After that, the silicon substrate 41 is eliminated by etching from a lower part, thus exposing the taper part 42 to a lower side. Then, a Cu layer is formed on a lower surface by the electroforming to cover the lower layer of the taper part 42 with the Cu layer. After that, the taper part 42 is exposed to a lower side again by polishing from the lower side. Finally, the SiO2 film is eliminated by the RIE from an upper part, thus manufacturing an optical head. As a result, since heat being generated by a light-shielding film absorbing incidence light is eliminated by the layer of a heat-conductive material, incidence light with a larger intensity can be used, thus capable of giving an output signal with a high S/N ratio.
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