发明名称 ELECTRONIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide an electronic module capable of easily performing an electrical inspection even when the percentage of an area of a component occupying on the main surface of a wiring board is large.SOLUTION: An electronic module includes: a wiring board having a first main surface and a second main surface that is a surface on an opposite side to the first main surface, and including a wiring pattern, which is provided on one main surface of the first and second main surfaces and has a land for mounting a component, and a conductor in a longitudinal direction provided so as to electrically conduct to the wiring pattern and so as to be exposed to an end surface that is a surface connected to the first main surface and the second main surface; and an electronic component mounted on the wiring board via the land while being superposed on the one main surface of the wiring board such that any probing to the wiring pattern cannot be performed.SELECTED DRAWING: Figure 1
申请公布号 JP2016076513(A) 申请公布日期 2016.05.12
申请号 JP20140203989 申请日期 2014.10.02
申请人 DAINIPPON PRINTING CO LTD 发明人 SAWADA KEISUKE
分类号 H05K1/18;H01L25/00;H05K1/11 主分类号 H05K1/18
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