发明名称 |
Heat sink chip package and method of making |
摘要 |
The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.
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申请公布号 |
US6122171(A) |
申请公布日期 |
2000.09.19 |
申请号 |
US19990364351 |
申请日期 |
1999.07.30 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
AKRAM, SALMAN;KINSMAN, LARRY |
分类号 |
H01L23/31;H01L25/10;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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