| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size by arranging a conductive pattern entirely between the rows of connection pads arranged intensively at the mounting part of driving element. SOLUTION: The thermal head comprises a head substrate provided with heating elements and a printed wiring board 5 secured onto a supporting plate wherein drive elements for the heating elements are mounted on the head substrate and connection terminals of the drive elements are connected electrically with connection terminals provided on the printed wiring board. Connection pad rows 15, 15 constituting the connection terminals on the printed wiring board connected electrically with the drive elements are arranged intensively in units of drive element and a part 16b not applied with an insulating film is formed to expose only the connection pad rows 15 and other regions are coated entirely with an insulating film 16. Since a conductive pattern 17a can also be formed between the connection pad rows 15, 15, the thermal head can be reduced in size.
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