发明名称 TEST CARRIER AND INSPECTION METHOD FOR BARE CHIP
摘要 PROBLEM TO BE SOLVED: To provide a test carrier allowing economical inspection of a bare chip even if the bare chip has a narrow-pitch electrode arrangement, and to provide an inspection method for the bare chip by use of the test carrier. SOLUTION: This test carrier has a contact sheet 50 made of polyimide, interposed between a carrier lid and a carrier base with a bare chip placed on the sheet 50, and including a wiring pattern 52 and through holes 54 at the same positions as through holes of an elastomer plate. The contact sheet 50 also has outer terminals 56 connected to an external inspection device outwardly, and inner end parts 58 at positions coinciding with respective electrode pads of the bare chip. Unlike a conventional contact sheet, the inner end part 58 is a pad having an Au layer on its upper face with no metal bump. The electrode pad of the bare chip has a bump of Au or an Au alloy.
申请公布号 JP2000249739(A) 申请公布日期 2000.09.14
申请号 JP19990050665 申请日期 1999.02.26
申请人 NEC CORP 发明人 TANIOKA MICHINAGA;KIMURA TAKAHIRO
分类号 H01R33/76;G01R31/26;(IPC1-7):G01R31/26 主分类号 H01R33/76
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