发明名称 |
FLEXIBLE WIRING SUBSTRATE, FILM CARRIER, TAPELIKE SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE OF SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND ELECTRONIC DEVICE |
摘要 |
A flexible substrate (1) comprises a long base (10), a plurality of wiring patterns (20) formed on the base (10), and a plurality of reinforcements (40). The reinforcements (40) extend lengthwise along the base (10). Each of the wiring patterns (20) deviates at least in part from the reinforcements (40) crosswise of the base substrate (10). |
申请公布号 |
WO0054324(A1) |
申请公布日期 |
2000.09.14 |
申请号 |
WO2000JP01389 |
申请日期 |
2000.03.08 |
申请人 |
SEIKO EPSON CORPORATION;YANAGISAWA, MASAHIKO |
发明人 |
YANAGISAWA, MASAHIKO |
分类号 |
H01L23/495;H05K1/00;H05K3/00;H05K3/24 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|