WIRING FORMING METHOD, MATRIX WIRING FORMING METHOD, MANUFACTURE OF MULTI-ELECTRON BEAM SOURCE, AND RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To sufficiently density the metal particle mass of a wiring to provide a wiring substrate free of vacuum leaks by successively performing wiring patterning process, baking process, and insulating process a plurality of times to form wirings on a substrate in a plurality of layers, and baking the wirings again after the final wiring patterning. SOLUTION: As the wiring patterning method, both of screen printing and photolithography are preferred. For example, line wirings 3 of 90μm in width are formed on a glass substrate 1 by use of silver paste, and baked at 480 deg.C for 10 minutes. The process of forming an insulating layer 4, consisting of glass paste on the line wirings 3 followed by baking at 400 deg.C for 10 minutes, is repeated four times to laminate the insulating layers 4. Row wirings 5 of silver paste are formed on the insulating layer 4 and baked at 400 deg.C for 10 minutes. A matrix wiring, consisting of the orthogonally crossing stripe line wirings 3 and row wirings 5, is formed on the substrate 1 via the insulating film. Furthermore, the baking of the substrate at 480 deg.C for 10 minutes is performed three times, whereby a wiring substrate free from disconnection or adjacent wiring short-circuit is provided.