| 摘要 |
PROBLEM TO BE SOLVED: To provide a connected ceramic wiring board having a high connection reliability between individual ceramic wiring boards formed with a plated layer evenly on a metallized layer in a recessed section and also provide a method for manufacturing such a wiring board and to provide a method for manufacturing the ceramic wiring board having the plated layer. SOLUTION: This substrate 11 comprises a plurality of ceramic wiring boards 1, each having a first principal plane 1A, and a second principal plane 1B which are connected to each other. On a boundary between adjacent ceramic wiring boards, a first break groove 13 is formed from the first principal plane 1A side, and a bottomed hole 15 which is opened on the second primary plane 1B side and is formed on its inner face 15B with a metallized layer 7 is formed, being stretched over the adjacent ceramic wiring boards 1. Part of the first break groove 13 passes through the bottom 14 of the hole 15 to allow the hole 15 and the first break groove 13 to communication with each other. Therefore, when forming a plated layer 8 on the metallized layer 7, a plating liquid can be easily allowed to follow between the first principal plane 1A and the second principal plane 1B through the hole 15, thereby forming the plated layer 8 evenly.
|
