| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component mounting apparatus and method for improving the mounting efficiency. SOLUTION: In this electronic component mounting method for mounting electronic components to a substrate by picking up the electronic components with a transfer head from a plurality of component-feeder provided in parallel. In this case, a plurality of chuck nozzles for holding electronic components by chucking them are provided to the transfer head. Thereby, the assumed remaining mounting number at the point when electronic components are picked up from each component-feeder in the combination of electronic components picked up in one reciprocal operation cycle of the transfer head with these chuck nozzles is determined, based on the residual mounting number histogram generated corresponding to the arrangement position of each component-feeder. Thereby, the electronic components can always be picked up efficiently in an optimal sequence. |
