| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a thin-film unit, in which a bump adheres well mechanically to the thin film of a thin-film laminate in which electrical resistance between the bump and the thin film can be decreased, when the bump is made of a conductive material. SOLUTION: A cut 10 is made into a thin film laminate 8 through a plurality of thin films 2, 3, 4, 5, 6, 7, 11 and thin film materials of different thin films 2, 3, 4, 5, 6, 7, 11 are cut off from the side face which defines the wall of the cut 10 thus forming at least two reverse hook parts 12 for each thin film directed inward of the cut 10 starting from the surface 9 of the laminate 8 abutting on the cut 10, and at least one protrusion 13 between both reverse hook parts. After a forming part is fabricated, a bump material 14 is charged into the cut 10 such that it is engaged with the back face of the reverse hook parts 12.</p> |
