发明名称 |
METHOD OF MANUFACTURING MULTILAYER WIRING BOARD |
摘要 |
A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer (27), a part thereof being electrically connected to a pillar-shaped metallic body (24a), after the pillar-shaped metal body (24a) is formed on a lower wiring layer (22) is characterized in that the step of forming the metallic body includes a sub-step of forming a plating layer (24) constituting the metallic body, a sub-step of forming a mask layer (25) on the surface where the metal body is formed, of the plating layer, and a sub-step of etching the plating layer. The manufacture can be carried out with simple equipment combination of conventional steps and the wiring layer can be made fine. Moreover, a multilayer wiring board having a high reliability can be manufactured. |
申请公布号 |
WO0052977(A1) |
申请公布日期 |
2000.09.08 |
申请号 |
WO2000JP01186 |
申请日期 |
2000.03.01 |
申请人 |
DAIWA CO., LTD.;YOSHIMURA, EIJI;HIGUCHI, TOSHIRO |
发明人 |
YOSHIMURA, EIJI;HIGUCHI, TOSHIRO |
分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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