| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for preventing a treating liquid from being adhered to the non-treating surface of a semiconductor wafer to aim at enhancement of the quality of the wafer and a reduction in the cost of the wafer in a chemical polishing treatment of the wafer. SOLUTION: This chemical polishing treatment method is a method, wherein a wafer W is made to chuck in a vacuum chuck 10, having a circular suction surface 10c of a diameter lightly shorter than that of the wafer W in a state that the peripheral edge part of the wafer W is overhung in the obliquely upper direction of the treating surface of the wafer W, gas for purge is sprayed on the lower surface of this overhung outer peripheral part of the wafer W facing upward obliquely from the outer peripheral part of the upper end of the chuck 10, a chemical polishing treating liquid and a cleaning liquid are made to scatter from the outer periphery of the wafer and an adhesion of the treating liquid and the cleaning liquid to the non-treating surface of the wafer and a creeping of a mist to the non-treating surface are prevented. By this prevention, a tapping, which has been hitherto applied for protecting the non-treating surface of the wafer, can be dispersed with.
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