摘要 |
PROBLEM TO BE SOLVED: To provide a socket with no conductive ball capable of testing easily a CSP different in an external size. SOLUTION: An outer circumferential face of a CSP 5 with no conductive ball is constituted to be positioned by a side part fixing part 32 to bring a connector 6 of the CSP 5 into contact with a pogo pin 22. When arrangement of the connector 6 is same, a test for the CSP 5 different in an external form is possible by adjusting the fixing part 32. Defective analysis for the CSP 5 is thereby carried out quickly at a low cost by this socket 1 without reproducing a solder ball, and a manufacturing cost of the socket 1 used for the CSP 5 of a new external size is reduced.
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