DETECTION METHOD AND APPARATUS OF CHIP ARRANGEMENT, AND BONDING METHOD AND APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a detection method of chip arrangement and a bonding method for improving productivity by controlling the arrangement of a regular chip in a wafer. SOLUTION: After dislocation in angle between an arranging direction of chips in a teaching wafer 1 and the X-direction of a wafer stage 2 is compensated for, the center coordinate of the teaching wafer 1 and the radius of the teaching wafer 1 are obtained. Then, the position of the orientation flat included in the wafer 1 is obtained, and the size and the position of a regular chip that is typically specified from regular chips are obtained. In addition, each space between the adjoining chips in the X-and Y-directions is obtained, and a regular chip arrangement map is calculated by an equipment control unit 4 on the basis of these data.