发明名称 |
Reduction of particle deposition on substrates using temperature gradient control |
摘要 |
A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.
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申请公布号 |
US6110844(A) |
申请公布日期 |
2000.08.29 |
申请号 |
US19950537192 |
申请日期 |
1995.09.29 |
申请人 |
SANDIA CORPORATION |
发明人 |
RADER, DANIEL J.;DYKHUIZEN, RONALD C.;GELLER, ANTHONY S. |
分类号 |
C23C14/54;C23C14/56;C23C16/44;C23C16/46;H01L21/205;H01L21/3065;H01L21/311;(IPC1-7):H01L21/302;H01L21/465 |
主分类号 |
C23C14/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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