发明名称 MANUFACTURE OF HOT PLATE AND SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To measure a temperature with good reproducibility and prevent dispersion in processing of a semiconductor substrate such as deposition by forming a heat generating electrode and a temperature measuring probe inside a plate body whereon a semiconductor substrate is mounted. SOLUTION: An electrostatic chuck electrode 3 for electrically fixing a semiconductor substrate by using electrostatic attraction and a heating heater line 4 as a heat generating electrode which is positioned below the electrode 3 are buried in an alumina substrate 2 as a plate body whereon a semiconductor substrate 1 is mounted. Two temperature measuring probes 5a, 5b formed of the same material as the heating heater line 4 are formed in the alumina substrate 2. Since first to sixth W films constituting the temperature measuring probes 5a, 5b are formed by screen print similar to the electrostatic chuck electrode 3 and the heating heater line 4, they can be formed with good reproducibility. Therefore, a temperature of a hot plate can be measured with good reproducibility.</p>
申请公布号 JP2000236015(A) 申请公布日期 2000.08.29
申请号 JP19990037729 申请日期 1999.02.16
申请人 TOSHIBA CORP 发明人 KATADA TOMIO;HAYASAKA NOBUO;OKUMURA KATSUYA
分类号 H01L21/302;H01L21/00;H01L21/205;H01L21/3065;H01L21/683;H05B3/68;(IPC1-7):H01L21/68;H01L21/306 主分类号 H01L21/302
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