| 摘要 |
PURPOSE: A rolled copper film for flexible printed circuit and a process for making thereof provides excellent bendability and proper softness characteristics. CONSTITUTION: A rolled copper film for flexible printed circuit and a process comprises below 10 weight ppm oxygen, and a T of the following defined equation are between the range of 4-34; T= 0.60£Bi|+0.55£Pb|+0.60£Sb|+0.64£Se|+1.36£S|+0.32£As|+0.09£Fe|+0.02£Ni|+0.76£Te|+0.48£Sn|+0.61£Ag|+1.24£P| (proviso, £i| is a weight ppm conc. of element i)each concentration of element are between the range of£Bi|<5, £Pb|<10, £Sb|<5, £Se|<5, £S|<15, £As|<5,£Fe|<20, £Ni|<20, £Te|<5, £Sn|<20, £Ag|<50, £P|<15, (proviso, £i| is weight ppm conc. of element i)The thickness is 5 - 50 micro meter, half softening temperature is 120 - 150°C, maintaining a tensile strength of over 300 N/mm2 at 30°C. |
