| 摘要 |
PURPOSE: A method and a system for bonding two surface provides a bonding of two surface which has minimum contact resistance while process temperature and pressure is lower; CONSTITUTION: A method and a system for bonding two surfaces comprises a 1st surface(10) include first metal layer(11), first gold layer(12) and first upper surface(13). A second surface(20) comprising first metal layer(21), second gold layer(22) and second upper surface(23). The first surface(10) and the 2nd surface(20) are placed between the first contact surface(100) and the 2nd contact surface(200). The 1st surface(13) of the first gold layer(12) and the second surface(23) of the 2nd gold layer(22) are contacting each other. The first contact surface(100) contacts with first surface(10), second contact surface(200) contacts with second surface(20). A first contact surface(100) and second contact surface(200) is heated by a thermal processor. The acting pressure of first gold layer(12) is transferred to second gold layer, the acting pressure acts between the first upper surface(13) and second upper surface(23). The first and second contact surface are heated to about 200-300°C 50-140MPa pressure is acting by the first contact surface(100) and second contact surface(200) in 10-60 seconds. |
