发明名称 |
Apparatus for conditioning polishing pads |
摘要 |
<p>A flexible conditioning apparatus and method for uniformly conditioning a polishing surface of a pad used to remove undesirable irregularities from a silicon wafer and to achieve a planar condition of the polishing pad. In a preferred embodiment of the present invention, a roughening member comprising a plurality of point contacts, such as diamond particles, is adapted for movement into and out of engagement with the surface of the pad. A flexible member supporting the roughening member allows the roughening member to conform to the surface of the pad to achieve uniform polishing of the pad. <IMAGE></p> |
申请公布号 |
EP0878269(A3) |
申请公布日期 |
2000.08.23 |
申请号 |
EP19980303220 |
申请日期 |
1998.04.24 |
申请人 |
INTEGRATED PROCESS EQUIPMENT CORP. |
发明人 |
KREAGER, DOUGLAS P.;LEE, JUNEDONG |
分类号 |
B24B53/007;B24B53/017;(IPC1-7):B24B37/04 |
主分类号 |
B24B53/007 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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