发明名称 |
PLACING AND POSITIONING MECHANISM FOR SEMICONDUCTOR WAFER CONTAINER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a placing and positioning mechanism which can improve the placing and positioning accuracy of a semiconductor wafer container over a long period. SOLUTION: A placing and positioning mechanism is provided with grooves 2 for positioning a semiconductor wafer container 1 is on the bottom face of a semiconductor wafer container 1, rotary bodies 3A which come into contact with the internal surfaces of the grooves 2, and supports 3B which rotatably support the rotary bodies 3A. The rotary bodies 3A quickly rotated upon coming into contact with the internal surfaces of the grooves 2 and can guide the container 1 to an accurate alignment position.</p> |
申请公布号 |
JP2000232149(A) |
申请公布日期 |
2000.08.22 |
申请号 |
JP19990031868 |
申请日期 |
1999.02.09 |
申请人 |
TOSHIBA CORP |
发明人 |
FURUKAWA SHINICHI;ROKUSHA TERUMI |
分类号 |
H01L21/68;H01L21/673;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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