LEAD FRAME RESTRAINING PAD DEFORMATION DUE TO HEAT

摘要

PURPOSE: A lead frame is to restrain a defect of a chip occurred during a process, such as protrusion of a part of a gold wire out of a package by complementing a structure of a pad or a tie bar. CONSTITUTION: A lead frame structure comprises: a lead frame body having a damper line and an inner lead(104) and an outer lead divided by the damper line and being cut by a punch in a packaging step; a pad(100) arranged on a center of the lead frame body; and a tie bar(102) connected from the lead frame body to the pad to support the pad. The pad is formed in a separate shape and is structured to be connected to each other by a slender connecting unit(106). The connecting unit is cut when heat is applied thereto. The tie bar is formed in a non-straight shape viewed in a plane direction to damp down a deformation occurred in the pad.