| 摘要 |
Positive photosensitive resin compositions, which comprise (A) a polyamidate having repetitive units of general formula (I) <CHEM> wherein R<1> is a tetravalent organic group, R<2> is a divalent organic group having a phenolic hydroxyl group, three R<3> groups and three R<4> groups each independently are an alkyl group or a hydrogen atom, and at least two R<3> groups and at least two R<4> groups are alkyl groups, and (B) a compound capable of generating an acid when exposed to light, are improved in storage stability and exposure sensitivity to i-line. Such compositions can improve the reliability of electronic parts when formed into surface-protecting films or interlayer insulating films by a method including exposure to i-line, development and heating. |
